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  specifications are subject to change without notice. customers should verify actual device performance in their specific applications. electrical characteristics max. time tripped i hold i trip to tr i p power resistance dissipation model amperes ohms amperes seconds watts v max. i max. at 23 ? at 23 ? at 23 ? at 23 ? at 23 ? volts amps hold trip r min. r 1max. typ. mf-smdf030 60 20 0.30 0.80 0.450 2.250 1.5 1.5 0.7 mf-smdf050 60 10 0.55 1.20 0.200 0.950 2.5 4.0 1.0 mf-smdf100 15 40 1.10 2.20 0.100 0.390 8.0 0.5 1.1 mf-smdf150 15 40 1.50 3.00 0.070 0.175 8.0 0.9 1.2 mf-smdf150/33 33 40 1.50 3.00 0.070 0.175 8.0 0.9 1.2 mf-smdf200 10 40 2.00 4.10 0.048 0.095 8.0 2.7 1.3 operating temperature ......................................-40 ? to +85 ? maximum device surface temperature in tripped state ................................................125 ? passive aging......................................................+85 ?, 1000 hours ....................................? % t ypical resistance change humidity aging....................................................+85 ?, 85 % r.h. 1000 hours ..................? % typical re sistance change thermal shock ....................................................+85 ? to -40 ?, 20 times ........................?0 % typica l resistance change solvent resistance ............................................mil-std-202, method 215 ........................no change vibration ..............................................................mil-std-883c, method 2007.1, ................no change condition a environmental characteristics test test conditions accept/reject criteria visual/mech.....................................verify dimensions and materials ....................................per mf physi cal description resistance ......................................in still air @ 23 ?........................................................... .rmin r r1max time to trip ....................................at specified current, vmax, 23 ? .................................. t max. time to trip (seconds) hold current ..................................30 min. at ihold ..............................................................no trip trip cycle life ................................vmax, imax, 100 cycles ..................................................no arcin g or burning trip endurance ................................vmax, 48 hours ..............................................................no ar cing or burning solderability ....................................ansi/j-std-002 ............................................................95 % min. coverage test procedures and requirements for model mf-smdf series mf-smdf series - ptc resettable fuses features very low profile high voltage lead-free construction symmetrical 2018 footprint agency recognition pending applications power over ethernet (ieee 802.3 af) port protection firewire and i.link ieee 1394 port protection automotive electronic control module protection telecom equipment low voltage protection new! thermal derating chart - i hold / i trip (amps) ambient operating temperature model -40 ?c -20 ?c 0 ?c 23 ?c 40 ?c 50 ?c 60 ?c 70 ?c 85 ?c mf-smdf030 0.48 / 0.96 0.42 / 0.84 0.35 / 0.70 0.30 / 0.60 0.24 / 0.48 0.21 / 0.42 0.17 / 0.34 0.15 / 0.30 0.10 / 0.20 mf-smdf050 0.86 / 1.72 0.77 / 1.54 0.70 / 1.40 0.55 / 1.10 0.48 / 0.96 0.43 / 0.86 0.38 / 0.76 0.36 / 0.72 0.26 / 0.52 mf-smdf100 1.59 / 3.18 1.43 / 2.86 1.20 / 2.40 1.10 / 2.20 0.94 / 1.88 0.85 / 1.70 0.72 / 1.44 0.69 / 1.38 0.57 / 1.14 mf-smdf150 2.21 / 4.42 1.97 / 3.94 1.70 / 3.40 1.50 / 3.00 1.26 / 2.52 1.15 / 2.30 1.00 / 2.00 0.91 / 1.82 0.73 / 1.46 mf-smdf150/33 2.21 / 4.42 1.97 / 3.94 1.70 / 3.40 1.50 / 3.00 1.26 / 2.52 1.15 / 2.30 1.00 / 2.00 0.91 / 1.82 0.73 / 1.46 mf-smdf200 2.81 / 5.62 2.54 / 5.08 2.27 / 4.54 2.00 / 4.00 1.73 / 3.46 1.59 / 3.18 1.46 / 2.92 1.32 / 2.64 1.12 / 2.24
product dimensions packaging: 2000 pcs. per reel. mf-smdf series - ptc resettable fuses abcde model min. max. min. max. min. max. min. min. mf-smdf030 4.72 5.44 4.22 4.93 0.79 1.09 0.30 0.25 (0.186) (0.214) (0.166) (0.194) (0.031) (0.043) (0.012) (0.010) mf-smdf050 4.72 5.44 4.22 4.93 0.79 1.09 0.30 0.25 (0.186) (0.214) (0.166) (0.194) (0.031) (0.043) (0.012) (0.010) mf-smdf100 4.72 5.44 4.22 4.93 0.79 1.09 0.30 0.25 (0.186) (0.214) (0.166) (0.194) (0.031) (0.043) (0.012) (0.010) mf-smdf150 4.72 5.44 4.22 4.93 0.79 1.09 0.30 0.25 (0.186) (0.214) (0.166) (0.194) (0.031) (0.043) (0.012) (0.010) mf-smdf150/33 4.72 5.44 4.22 4.93 0.79 1.09 0.30 0.25 (0.186) (0.214) (0.166) (0.194) (0.031) (0.043) (0.012) (0.010) mf-smdf200 4.72 5.44 4.22 4.93 0.79 1.09 0.30 0.25 (0.186) (0.214) (0.166) (0.194) (0.031) (0.043) (0.012) (0.010) mm (inches) unit = terminal material: electroless ni under immersion au termination pad solderability: standar d au finish: meets ansi/j-std-002 category 2. optional sn finish: meets ansi/j-std-002 category 3. recommended storage: 40 ? max./70 % rh max. a b c top and bottom view side view d e recommended pad layout 4.6 0.1 (.181 .004) 3.4 0.1 (.134 .004) 1.5 0.05 (.059 .002) 1.5 0.05 (.059 .002) typical time to trip at 23 ?c 0.01 0.1 1 0.001 0.1 1 10 100 10 100 fault current (amps) time to trip (seconds) mf-smdf030 mf-smdf050 mf-smdf200 mf-smdf150 mf-smdf100 the time to trip curves represent typical perform- ance of a device in a simulated application environment. actual performance in specific customer applications may differ from these values due to the influence of other variables. specifications are subject to change without notice. customers should verify actual device performance in their specific applications.
how to order mf - smdf 150/33 t - 2 multifuse product designator series smdf = 2018 surface mount component hold current, i hold 030-200 (0.30 amps - 2.00 amps) higher voltage option __ = standard voltage /33 = 33 volt rated optional terminal finish __ = standard au finish t = optional sn finish packaging packaged per eia 481-1 -2 = tape and reel specifications are subject to change without notice. customers should verify actual device performance in their specific applications. mf-smdf series - ptc resettable fuses typical part marking represents total content. layout may vary. part identification: 30 = mf-smdf030 05 = mf-smdf050 10 = mf-smdf100 15 = mf-smdf150 20 = mf-smdf200 year code: 3 = 2003 bi-weekly date code: weeks 13-14 = g manufacturer's trademark 10 3 g 160C220 300 250 200 150 100 50 0 10C20 temperature ( c) 120 preheating soldering cooling time (seconds) solder reflow recommendations notes: mf-smdf models cannot be wave soldered. if reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. compatible with pb and pb-free solder reflow profiles. mf-smdf series, rev. b, 05/04
mf-nsmf series mf-smdf series tape dimensions per eia 481-1 per eia 481-2 w p 0 p 1 p 2 a 0 b 0 b 1 max. d 0 f e 1 e 2 min. t max. t 1 max. k 0 leader min. trailer min. reel dimensions a max. n min. w 1 w 2 max. specifications are subject to change without notice. customers should verify actual device performance in their specific applications. mf-nsmf & mf-smdf series tape and reel specifications b 1 n(hub dia.) (measured at hub) a t cover tape k 0 t 1 a 0 w 2 (measured at hub) w 1 p 1 b 0 f d 0 p 2 p 0 e 2 e 1 w unit = mm (inches) 8.0 0.30 (0.315 0.012) 4.0 0.10 (0.157 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 1.85 0.10 (0.073 0.004) 1.75 0.10 (0.069 0.004) 1.50 + 0.1/-0.0 (0.059 + 0.004/-0) 8.4 + 1.5/-0.0 (0.331 + 0.059/-0.0) 4.35 (0.171) 6.25 (0.246) 0.6 (0.024) 0.1 (0.004) 390 (15.35) 160 (6.30) 185 (7.28) 50 (1.97) 14.4 (0.567) 16.0 0.3 (0.630 0.012) 4.0 0.1 (0.157 0.004) 8.0 0.1 (0.315 0.004) 2.0 0.1 (0.079 0.004) 5.1 0.15 (0.201 0.006) 5.6 0.23 (0.220 0.009) 7.5 0.10 (0.295 0.004) 1.75 0.10 (0.069 0.004) 1.0 0.15 (0.039 0.015) 1.5 + 0.1/-0.0 (0.059 + 0.004/-0) 16.4 + 2.0/ -0.0 (0.646 + 0.079/-0.0) 12.1 (0.476) 14.25 (0.561) 0.6 (0.024) 0.1 (0.004) 390 (15.35) 160 (6.30) 331 (13.03) 50 (1.97) 22.4 (0.882) 3.45 0.10 (0.136 0.004) 0.74 0.10 (0.029 0.004)


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